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Advanced Packaging Leads The Way To Intel Foundry Success

تكنولوجيا
Forbes
2026/05/21 - 00:28 517 مشاهدة
تحليل ذكي | AI Editorial Analysis

InnovationAIAdvanced Packaging Leads The Way To Intel Foundry SuccessByFrancis Sideco,Contributor.Forbes contributors publish independent expert analyses and insights.

Tech/Strategy executive advisor focused on all things techfor Tirias ResearchFollow AuthorMay 20, 2026, 08:28pm EDT--:-- / --:--This voice experience is generated by AI.

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هذا الخبر من Forbes. خبر يقدم أدوات ذكاء اصطناعي للتلخيص والترجمة والاستماع.

InnovationAIAdvanced Packaging Leads The Way To Intel Foundry SuccessByFrancis Sideco,Contributor.Forbes contributors publish independent expert analyses and insights. Tech/Strategy executive advisor focused on all things techfor Tirias ResearchFollow AuthorMay 20, 2026, 08:28pm EDT--:-- / --:--This voice experience is generated by AI. Learn more.This voice experience is generated by AI. Learn more.Intel's Rio Rancho FacilityIntelEver since former Intel CEO Pat Gelsinger announced in 2021 that Intel was entering the semiconductor foundry business, the focus has been on Intel’s ability to compete on the most advanced semiconductor process nodes. With this came the announcement of five new process nodes in four years and new state-of-the-art manufacturing facilities in Arizona and Ohio. To its credit, Intel delivered on the new process nodes, the most advanced being Intel 18A, which is now in volume production in Intel products at Fab 25 in Hillsboro, Oregon and Fab 52 at Intel’s Ocotillo site in Chandler, Arizona. In Arizona, the sheer size of both Fab 52 and Fab 62, as well as the 700-acre site that holds four other fabs (12, 22, 32, and 42), is impressive. However, Intel is still in the early stages of working with its initial customers for both the current Intel 18A process and the forthcoming Intel 14A process. But the other side of Intel Foundry, responsible for advanced semiconductor packaging, is a completely different story.One of Intel’s core competencies is semiconductor manufacturing, and it has always led the industry in the research and development of new fabrication processes and packaging technology. Despite its stumbles in bringing new process nodes to market starting around 2013 with the 14nm generation, Intel never missed a beat in advanced packaging. In fact, many companies inquired about using Intel’s advanced packaging capabilities when it first explored becoming a foundry as early as 2010, but Intel’s management refused to consider packagin...
المصدر: Forbes | Source: Forbes

ملاحظة تحريرية | Editorial Note: نُشر هذا المقال في الأصل بواسطة Forbes. خبر (Khabr) هي منصة إعلامية أردنية مرخّصة تعمل بالذكاء الاصطناعي. نضيف قيمة تحريرية من خلال: تحليل ذكي للأخبار، ملخصات تلقائية، رواية صوتية بالذكاء الاصطناعي، ترجمة متعددة اللغات، وتدقيق الحقائق. هدفنا جعل الأخبار أكثر وضوحاً وسهولةً للقارئ العربي.

This article was originally published by Forbes. Khabr is a licensed Jordanian AI-powered news platform (Registration #82086). We add editorial value through: AI-powered news analysis, automated summaries, AI audio narration, multi-language translation (Arabic, English, French, Turkish), and AI fact-checking. Our mission is to make news more accessible and understandable for Arabic-speaking audiences worldwide.

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المزيد عن تكنولوجيا | More on Technology

هذا الخبر ضمن تغطية خبر لقسم تكنولوجيا. نقدّم لك تحليلات ذكية وملخصات يومية لأهم الأخبار من مصادر موثوقة متعددة. المصدر: Forbes. يوجد 6 مقالات مرتبطة بهذا الموضوع.

This article is part of Khabr's coverage of Technology. We provide AI-powered analysis, summaries, and multi-source aggregation to keep you informed. Source: Forbes. Tags: packaging, Intel, technology.

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